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June 2011

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Subject:
From:
Gerry Gagnon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gerry Gagnon <[log in to unmask]>
Date:
Thu, 9 Jun 2011 13:49:27 -0400
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Me too. It looks like oxidized nickel which will not wet.
 
> Date: Thu, 9 Jun 2011 09:12:00 -0700
> From: [log in to unmask]
> Subject: Re: [TN] Black Pad?
> To: [log in to unmask]
> 
> I'm with Steve on this one...
> 
> Paul
> 
> Paul Edwards
> Process/Quality Engineering
> Surface Art Engineering
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Thursday, June 09, 2011 6:59 AM
> To: [log in to unmask]
> Subject: Re: [TN] Black Pad?
> 
> Hi Gary,
> 
> I got your pictures this morning, and have them posted now:
> 
> http://stevezeva.homestead.com/Joint_1.JPG
> 
> http://stevezeva.homestead.com/Joint_2.JPG
> 
> http://stevezeva.homestead.com/via.JPG
> 
> Although the pictures show some non-wetting happening, it's difficult to see
> what exactly is going on.
> 
> You say that the component side seems fine, it's just when you're trying to
> wave solder is when you see the problem. Maybe you have thin gold, and when
> the boards were fresh, the SMT was able to solder fine. But then after the
> boards went through reflow, the underlying nickel oxidized so badly that
> solder wasn't able to wet?
> 
> Steve
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Gary Robinson
> Sent: Wednesday, June 08, 2011 4:46 PM
> To: [log in to unmask]
> Subject: [TN] Black Pad?
> 
> We have noticed a problem only on ENIG boards in our WAVE process that looks
> similar to Black Pad but do not know how to identify or where to begin to
> find a resolution to the problem. We were hoping an expert may have
> experience in seeing this problem. Here are some facts -
> 1. Black residue is on the vias and thts on the solder side. Please see the
> attached images.
> 2. Component Side SMT Parts do not exhibit the same problems.
> 3. Boards are processed PbFree - SAC305, Pacific 2009m No Clean Water Based
> flux
> 4. THTs will not wet after residues appear (for touch up process)
> 5. Blowholes appear to accompany the defect but are not always present.
> 
> Thanks for your help in advance.
> 
> 
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