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Date: | Mon, 18 Jun 2007 10:59:01 EDT |
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Good (time of day here) colleagues,
Does anyone know of a statistical base that identifies assembly failures and
traces them to causes with some sort of breakdown?
That is failures traced to assembly only (e.g., opens, shorts, insufficient
cleaning, etc.), failures related to PCB manufacturing only (e.g., PTH
failure, opens, shorts, CAF, etc.) and failures traced to the components themselves
of any cause (ESD, overheating, thermal cycling failure, etc.).
I realize that this may be a sensitive topic for some folks and am thus open
to taking any such data off line.
However any perspective based on experience and "guessimates" from the
general audience is encouraged and most welcomed to see if there is any kind of
consensus of experience and how close it matches with the the industry's general
perceptions.
Rough (in the same city at the ball park) estimates are OK.
Thanks in advance for any form of light that can be shed while I fumble
around in the dark feeling for the "main lightswitch". ;-)
Best to all,
Joe
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