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Subject: New substrate materials for P-BGA (PPE based)
We would like to introduce our new materials.
We are leading PWB manufacturer in Japan and have developed new
substrate matherials for P-BGA.
These are glass/PPE copper clad laminate, double sided model name is
TLC-W-596.
These are best fit for low-dielectric/high heat resistance printed circuit
application.
Features are the following.
1) Low Dielectric Constnt (3.6 or 4.0)
2) Low Dissipation Factor (below 0.0022)
3) Excellent for High Temperature Application
4) Higher Tg:200-210℃(DMA)
5) Excellent Humidity Resistance.
Please do not hesitate contact us.
TOSHIBA CHEMICAL CORPORATION.
International Operations Dept. E.Yorozu
3-9 Shimbashi 3-Chome, Minato-Ku. 105, Japan
E-mail : [log in to unmask]
TEL: 81-3-3502-3217
FAX: 81-3-3502-3979
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