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July 2012

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TechNet <[log in to unmask]>
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Date:
Tue, 17 Jul 2012 09:37:36 -0400
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TechNet E-Mail Forum <[log in to unmask]>, Stephen Ayotte <[log in to unmask]>
Subject:
Module Build, Wafer picking capability
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Stephen Ayotte <[log in to unmask]>
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I am not sure who on the distribution performs module assembly but I have 
a question for those who do.

Is your die picking tool capable of seeing a die with an ink dot 
indicating the die is not to be picked.

Thanks.


Stephen Ayotte
Manufacturing Quality Engineer
Bldg. 966 - 2,  Office 2J1309
Userid:  Stephen Ayotte/Burlington/IBM 
Internet id: [log in to unmask]
Phone:  802 769 4775


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