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September 1999

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Subject:
From:
su-kyoung Lee <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 13 Sep 1999 17:13:10 +0900
Content-Type:
text/plain
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mail.txt (21 lines)
Hell, technetters.
what is super solder technology on the bump pad?
Is SST adequit for soldering on pad?
what is the adequit height of the solder and flux before and after plattening?
I'm searching for the possible soldering  process on the small bump pad.
thanks. all

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