Hi Leland,
Are there any other suggested options (other than not
building a defect in the first place)?
That actually is not a bad option; unless something is seriously wrong, opens, non-wets, and head-in-pillows should not be a problem if your reflow process is properly profiled.
Werner
-----Original Message-----
From: Leland Woodall <[log in to unmask]>
To: [log in to unmask]; [log in to unmask]
Sent: Tue, Oct 6, 2009 2:18 pm
Subject: RE: [TN] BGA X-Ray Defect Detection Capabilities
Sounds like I’ve been led down a rosy pathway. I thought these machines
would do everything but serve you a cup of coffee.
Both of them were 3D with an option to inspect in 2D (or provide
a combination of the two). If the 3D option is utilized and indeed inspecting
every solder joint on one BGA, can the machine be “tweaked” enough to assure we’ll
catch all the opens, non-wets, and head-in-pillows?
If not, I’ve got to back up and punt, and the defensive line is
bearing down quickly! Are there any other suggested options (other than not
building a defect in the first place)?
Nothing ever goes as planned…
Leland
From: [log in to unmask]
[mailto:[log in to unmask]]
Sent: Tuesday, October 06, 2009 1:44 PM
To: [log in to unmask]; Leland Woodall
Subject: Re: [TN] BGA X-Ray Defect Detection Capabilities
=0
A
Hi Leland,
John Burke gave you good advice. Forget 2-D for the defects you are interested
in, and 3-D is not much better except for some very specialized machines that
look at SJs individually—bad part is of course, not very useful in mass
production.
Werner
-----Original Message-----
From: Leland Woodall <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Oct 6, 2009 11:55 am
Subject: [TN] BGA X-Ray Defect Detection Capabilities
Everyone,
I just came back from an X-ray vendor qualification trip, and of course,
have a few questions for my professional peers.
Both vendors experienced problems reliably detecting opens and non-wets.
I really didn't expect to see this, as I thought these would be two of
the most common defects seen among BGA users. We had to leave boards at
both facilities so they could further develop their algorithms.
We were not able to create a head-in-pillow defect, and thus, were not
able to check their machines for this. They also had no sample boards
that carried such an anomaly. Is this another defect that is difficult
to detect, and must one utilize a 3D machine in order to fi
nd it
(assuming the machine is capable of both 2D and 3D inspections, and
there are no components
beneath the BGA)?
Are there any other caveats you might be able to provide? Our list of
questions and qualification efforts were extensive, but I'm certain we
missed something. I just hope whatever it was fell outside of being a
critical item...
Thanks in advance,
Leland
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