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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 27 Sep 2001 11:14:13 +0800 |
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We used to heat soak assemblies to be reworked for 2 hours at 90 deg C in a
calibrated oven, and re-heat them for half an hour after approx every 10
minutes of rework (if they took that long). Typically-used temperature ramp
rate for PCA's is 5 deg C/minute.
If you want to fine-tune the soak period to reduce the time in the oven,
stick a couple of thermocouples on the board attached to a data logger, and
see how long it takes for the board to reach the soak temperature.
Peter Duncan
"Rougeux, Scott"
<Scott.Rougeux@P To: [log in to unmask]
LEXUS.COM> cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST
Sent by: TechNet Aero/ST Group)
<[log in to unmask] Subject: [TN] FW: preheating assemblies prior
> to rework
09/27/01 03:21
AM
Please respond
to "TechNet
E-Mail Forum."
> Your input is requested on this issue.
> In regards to preheating assemblies prior to reworking them on the Solder
> Fountain/solderpot.
> We have been asked to look into preheating components or boards during
> rework. This opens many questions:
> * What is the desirable preheat temperature?
> * How is it measured?
> * Where is it measured?
> * How quickly can the assembly be heated?
> Thanks.
>
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