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From [log in to unmask] Mon May 19 09: |
41:34 1997 |
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Robert,
What are the issues with the assembly process?
______________________________ Reply Separator _________________________________
Subject: Problems with Via in Pads
Author: [log in to unmask] at corp
Date: 5/15/97 10:00 AM
Hi TechNetters,
We are experiencing assembly problems with 13.5 mil drilled vias in pad
from one of our board suppliers. After looking at cross sections from a
sample during the problem period, I suspect that the root cause of the
problem is irregular hole walls due to drilling. My questions are regarding
the drill operation.
How many boards are acceptable in a stack up at drill assuming .062"
multilayer and .0135" drills?
With the proper stack up, how many hits are acceptable for a new and/or
a resharpened drill?
How many times can a .0135" drill be reliably resharpened?
Any other thoughts as to the cause of rough hole walls on via holes would be
appreciated.
Thanks,
Robert Furrow at Lucent Technologies, North Andover, Ma.
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