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April 2002

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Subject:
Accelerated test for simulation of storage of PCBs with surface finish white tin
From:
Peter Hefti <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 25 Apr 2002 09:29:50 +0200
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Hello TechNet:

We are searching for a method of accelerated aging of PCBs with surface
finish in white tin (chemical  tin).
This method should be recognized , in order to simulate the storage of 6
or 12 month under normal conditions.
(85/85/1d or 2d  test ??)
After such an accelerated test, the solderability will be tested by the
wetting balance method.

Thank you for your answer

With best regards

Peter Hefti

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