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July 1997

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by ipc.org (Smail3.1.28.1 #2) id m0wsLul-000Bj9C; Sun, 27 Jul 97 00:30 CDT
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From [log in to unmask] Mon Jul 28 09:
48:59 1997
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Re: Gold peel after solder level
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[log in to unmask] (Paul A Galatis)
>From willli Sun Jul 27 00:
30:58 1997
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Andy,

If you found Ni on both sides of the peel it was probably caused by high
pH in the Ni plating bath, usually with the help of a current
interruption.  Hope this helps.

Paul Galatis

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