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April 2023

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Subject:
BGA / CPU Underfill
From:
"Hernandez, Victor G" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernandez, Victor G
Date:
Wed, 12 Apr 2023 10:38:26 +0000
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Fellow TechNetters:

   Besides J-STD-030A and 7095D-WAM1. Is there any others documents that cover underfill process.
Is partial under fill, uncontrol fill depth, process allowable/acceptable.   What are the PROS & CONS.

Victor,

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