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| From [log in to unmask] Wed Dec 18 08: |
23:32 1996 |
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by ipc.org (Smail3.1.28.1 #2)
id m0vaAYW-0000S6C; Tue, 17 Dec 96 19:12 CST |
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[log in to unmask] (James Edwards) Wrote:
|
| Could someone tell me the advantages of using Gold/NI vs HASL
| and
| what are the common (if any) process problems I may encounter
| when
| screening/placing parts/soldering to these type boards using
| 63/37 eutectic solder paste? Any wave solder issues? Thanks
James,
The August 1995 edition of Electronic Packaging & Production has a paper
titled as "Alternatives to HASL: A Uer's Guide For Surface Finishes",
which gives a pretty summary on alternative PCB surface technology,
including Ni/Au. It also include a comparison chart for HASL, Ni/Au, OSP,
Matte Tin in terms of fine pitch capability, electrical contact, cost and
etc.
Qun Xiao
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