Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 15 Mar 2002 14:41:52 -0700 |
Content-Type: | multipart/alternative |
Parts/Attachments: |
|
|
Earl.
You might find this short report interesting:
> DOC=DOT/FAA/AR-01/41 DDATE=01-AUG-2001 DD=CTD
>
> Title: REVIEW OF PENDING GUIDANCE AND INDUSTRY
> FINDINGS ON COMMERCIAL OFF-THE-SHELF (COTS) ELECTRONICS IN AIRBORNE SYSTEMSAbstract: March 11,
> 2002 THE INTENT OF THIS REPORT IS TO PROVIDE FINDINGS ABOUT THE STATE OF THE INDUSTRY RELATIVE
> TO THE DESIGN OBJECTIVES IDENTIFIED IN GUIDANCE DOCUMENT DO-254 WITH FOCUS ON THE IMPLICATIONS
> FOR THE USE OF COMMERCIAL OFF-THE-SHELF (COTS) ELECTRONIC HARDWARE COMPONENTS IN SAFETY
> CRITICAL AIRBORNE SYSTEMS. THE USE OF COMPLEX ELECTRONIC HARDWARE COMPONENTS IN AIRBORNE
> SYSTEMS POSES A CHALLENGE TO THE MEETING OF SAFETY REQUIREMENTS BECAUSE, FOR COMPLEX
> COMPONENTS, COMPLETE VERIFICATION IS, AT BEST, VERY DIFFICULT AND, AT WORST, NOT ACHIEVABLE. IN
> ORDER TO ADDRESS THE POTENTIAL LACK OF COMPLETE VERIFICATION, IT IS RECOMMENDED THAT THE HARDWARE
> DESIGN LIFE CYCLE PROCESSES SHOULD INCLUDE DESIGN ASSURANCES TO MITIGATE THE POSSIBILITY THAT
> DESIGN ERRORS MAY BE INTRODUCED INTO THE HARDWARE COMPONENT AND CAUSE ANOMALOUS BEHAVIOR. NEW
> TECHNOLOGIES, BEING DEVELOPED IN THE COMMERCIAL SECTOR, COULD PROVIDE ENHANCED SAFETY IN
> AIRBORNE SYSTEMS IF THE TECHNOLOGIES COULD BE INCORPORATED AT AN AFFORDABLE COST. HOWEVER, THE
> USE OF COTS COMPONENTS IN AIRBORNE SYSTEMS RAISES A NUMBER
> OF ISSUES WITH RESPECT TO MEETING AIRBORNE SYSTEM SAFETY REQUIREMENTS AND DO-254 OBJECTIVES.
> COMMERCIAL MARKET TRENDS ARE RAPIDLY DIVERGING FROM THE NEEDS OF SAFETY CRITICALAIRBORNE SYSTEMS.
> ISSUES WITH RESPECT TO COTS USAGE MAY BECOME BARRIERS IN CERTAIN CASES, IF NECESSARY ASSURANCES
> CANNOT BE ACHIEVED IN A COST EFFECTIVE MANNER. THE ASSURANCES REQUIRED
> FOR HIGH CRITICALITY APPLICATIONS SUCH AS LEVELS A AND B WILL PROBABLY NOT BE ATTAINABLE FOR COTS
> COMPONENTS WITHOUT MITIGATION BY OTHER MEANS.
>
> David A. Douthit
> Manager
> LoCan LLC
Earl Moon wrote:
> All the little DSP BGA's soldered fine. 4 of 5 boards even work with the
> world's worst design ever.
>
> The story is not over, but it's off to a good start. My thanks to
> Sanmina/Hadco tech fab center East and the fine people there. Also, my hat's
> off to Sanmina's tech assembly center in Austin. Both busted ass and came
> through, against all odds. Thank you too Jason Gregory.
>
> I'm outa here finally and going gambling and gamboling in Nevada. Then it's
> off to do automotive stuff.
>
> MoonFreeMan
>
> ---------------------------------------------------------------------------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> ---------------------------------------------------------------------------------
|
|
|