Conference Proceedings are Now Available for:
IPC's Third Annual Summit on PWB Surface Finishes and Solderability, September 23-24,
1999, Irvine, California

PWB solderability is at the heart of electronic interconnections, uniting the fates
of the fabricator, the assembler, the OEM system designer and the component
manufacturer.  The proceedings from IPC's Third Annual National Conference: A Summit
on PWB Surface Finishes and Solderability, held September 23-24, 1999 in Irvine,
California, provide an in-depth review of the surface material options that succeed
in today's ultra high density, fine pitch environment.  The proceedings include
nearly twenty papers/presentations with case studies and test results on immersion
silver and tin, nickel/gold, and organic solderability preservatives as well as
information on surface finishes for high density component packages.  Released
September 1999.  Volume I: 180 pages; Volume II: 145 pages.

Member Price: $50.00           Non-Member Price: $100.00

Proceedings can be ordered in the following ways:
Phone:  (847) 790-5362
Fax: (847) 509-9819
Email: [log in to unmask]
IPC's Home Page: URL: http://www.ipc.org/html/orderfrm.htm

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Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
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