Conference Proceedings are Now Available for: IPC's Third Annual Summit on PWB Surface Finishes and Solderability, September 23-24, 1999, Irvine, California PWB solderability is at the heart of electronic interconnections, uniting the fates of the fabricator, the assembler, the OEM system designer and the component manufacturer. The proceedings from IPC's Third Annual National Conference: A Summit on PWB Surface Finishes and Solderability, held September 23-24, 1999 in Irvine, California, provide an in-depth review of the surface material options that succeed in today's ultra high density, fine pitch environment. The proceedings include nearly twenty papers/presentations with case studies and test results on immersion silver and tin, nickel/gold, and organic solderability preservatives as well as information on surface finishes for high density component packages. Released September 1999. Volume I: 180 pages; Volume II: 145 pages. Member Price: $50.00 Non-Member Price: $100.00 Proceedings can be ordered in the following ways: Phone: (847) 790-5362 Fax: (847) 509-9819 Email: [log in to unmask] IPC's Home Page: URL: http://www.ipc.org/html/orderfrm.htm ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################