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February 2010

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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 17 Feb 2010 20:36:51 +0800
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TechNet E-Mail Forum <[log in to unmask]>, Lum Wee Mei <[log in to unmask]>
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Lum Wee Mei <[log in to unmask]>
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Hi Paul,
 
I would like a copy, too.
 
Thanks and Regards,
~ Wee Mei ~


On Tue, Feb 16, 2010 at 7:30 PM, Paul Reid <[log in to unmask]>wrote:

> Hi All,
>
> It seems like there is interest in microvia reliability.
>
> I am sending out three microvia white papers to those that request them.
>
>
> The papers do not tell the whole story on microvia reliability but it is
> a good overview of the most influential factors affecting microvias, how
> to test microvias and how they fail.
>
> These papers were presented at IPC, EIPC and appeared in various
> publications.
>
> Here is one of the two iconnect007 interviews on microvias I did with
> Ray Rasmussen
> http://www.pcb007.com/pages/zone.cgi?a=50577&artpg=1&topic=0
>
> In responding to requests there will be no nice note in the reply emails
> just the papers ... just the beef.
>
> I am planning to give a quiz after.
>
>
> Sincerely,
> Paul Reid
>
> Program Coordinator
> PWB Interconnect Solutions Inc.
> 235 Stafford Rd., West, Unit 103
> Nepean, Ontario
> Canada, K2H 9C1
> 613 596 4244 ext. 229
> Skype paul_reid_pwb
> [log in to unmask] <mailto:[log in to unmask]>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Shanmugam, Nagaraj
> Sent: February 16, 2010 12:29 AM
> To: [log in to unmask]
> Subject: [TN] pros & cons of going for HDI Staggered & Stacked via
>
>  Hi All,
>
> We faced problem with Stacked via related to thermal effect resulting in
> via cracking, I like to know form the group in detail about the HDI
> reliability.
> What are the pros & cons of going for HDI Staggered & Stacked  via?
>
> TIA,
> Nagaraj.
>
>
> Nagaraj
>
>
>
>
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--
Best Regards
Mickey Weiner
972-8-9774808

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