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January 1999

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Subject:
From:
Gabriela Bogdan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 9 Jan 1999 02:29:10 +0200
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[log in to unmask] wrote:

> Gaby,
>
> Sorry about your troubles. I've never run into it with through hole
> devices, but many times with SMT
> types having been reflowed and often needing touched-up because of
> poor solder termination
> solderability.
>
> It sounds and looks (in x-section) like a smilar problem. The fine
> coil wires become detached under
> thermal stress because of dissimilar expansion rates at the attachment
> "legs."
>
> We solved some, not all, problems by changing a supplier once to
> improve solderability. In another
> instance, we more carefully watched our profiles to do everything
> possible to avoid touch-up.
>
> Good luck,
>
> Earl Moon
>
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 Thanks, Earl!
Gaby

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