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Subject:	Re: Ceramic BGA's on FR4,any thermal coefficient problems
From:	Lee Whiteman <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 31 Jul 2001 11:17:27 -0400
Content-Type:	multipart/alternative
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Rick,

You might want to consider getting copies of these reports:

  Ceramic Ball Grid Array Assembly Reliability in Military Applications by
T. Scheler, P. Viswanadham, M. Garza, S. Dunford, B. Thomas; presented at
IPC/SMTA Expo, October 1998

  Ball Grid Array Packaging Guidelines by JPL and ITRI; August, 1998. You
can get it via the website for a nominal fee:  http://www.itri.org/

Granted, these studies operated at a higher range than what you requested,
but they may provide useful information. Give me a call off line and let's
talk.

Lee Whiteman
Senior Manufacturing Engineer
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x208
Fax: (610) 362-1290


  > -----Original Message-----
  > From: TechNet [mailto:[log in to unmask]]On Behalf Of Rick Summers
  > Sent: Thursday, July 26, 2001 1:55 PM
  > To: [log in to unmask]
  > Subject: [TN] Ceramic BGA's on FR4,any thermal coefficient problems
  >
  >
  > Has there been any studies completed to prove or disprove thermal
  > coefficient problems between ceramic BGA's mounted on FR4 causing
  > long term
  > reliability problems of the BGA balls (solder ball separating
  > from PWB) over
  > commercial and industrial temperature ranges?
  > Commercial temp range: 0O C to +70 O  C.
  > Industrial temp range: -40 O C to + 80 O  C.
  >
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