Hi Rich-

I'm unfamiliar with this type of product. Are you sure you are talking
about encapsulation, or are you thinking "underfill".

The "usual way" of making a BGA-based module which can be reflowed is to
first underfill the BGA. That is very complicated to implement. For low
quantity stuff, where you can't do the massive qualification necessary to
get the underfill process fully validated, most of us just let the BGA
reflow with no encapsulation or underfill.

Trying to get away without full qualification of the underfill process will
lead to much misery. The underfill system includes:

   - The material on the bottom of the BGA
   - The soldermask on the PCB the BGA is reflowed to
   - Flux chemistry
   - Cleaning chemistry and effectiveness

System failure usually results in a tiny crack opening up at either the BGA
surface or the PCB soldermask. The underfill mechanical characteristics at
high temperatures usually ends up causing pressure on the molten solder.
This molten solder then flows into the cracks and creates amazing shorts
that are very difficult to see on X-Ray inspection.

Even just getting proper underfill flow and cure can be a big job. Several
years ago I was responsible for a line doing this and learned that
incredibly small amounts of moisture in the PCB material can force its way
into the underfill chemistry because of the captured volume beneath the
BGA. The result is a new substance that has no redeeming qualities for the
underfill situation!

Good Luck!

Wayne Thayer

On Mon, Jun 15, 2020 at 8:16 AM Richard Kraszewski <
[log in to unmask]> wrote:

> I have a potential need for a reflow encapsulant for a BGA
> Had reached out  to Henkel  but was informed that they had  discontinued
> that  product line.
> Anyone have a different source?
>
> Rich  Kraszewski
> Senior Staff Process Engineer
> Plexus
>
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