Hi Rich- I'm unfamiliar with this type of product. Are you sure you are talking about encapsulation, or are you thinking "underfill". The "usual way" of making a BGA-based module which can be reflowed is to first underfill the BGA. That is very complicated to implement. For low quantity stuff, where you can't do the massive qualification necessary to get the underfill process fully validated, most of us just let the BGA reflow with no encapsulation or underfill. Trying to get away without full qualification of the underfill process will lead to much misery. The underfill system includes: - The material on the bottom of the BGA - The soldermask on the PCB the BGA is reflowed to - Flux chemistry - Cleaning chemistry and effectiveness System failure usually results in a tiny crack opening up at either the BGA surface or the PCB soldermask. The underfill mechanical characteristics at high temperatures usually ends up causing pressure on the molten solder. This molten solder then flows into the cracks and creates amazing shorts that are very difficult to see on X-Ray inspection. Even just getting proper underfill flow and cure can be a big job. Several years ago I was responsible for a line doing this and learned that incredibly small amounts of moisture in the PCB material can force its way into the underfill chemistry because of the captured volume beneath the BGA. The result is a new substance that has no redeeming qualities for the underfill situation! Good Luck! Wayne Thayer On Mon, Jun 15, 2020 at 8:16 AM Richard Kraszewski < [log in to unmask]> wrote: > I have a potential need for a reflow encapsulant for a BGA > Had reached out to Henkel but was informed that they had discontinued > that product line. > Anyone have a different source? > > Rich Kraszewski > Senior Staff Process Engineer > Plexus > > * * * * * * * * CONFIDENTIALITY NOTICE * * * * * * * * > > This e-mail and any attachments are confidential from Plexus Corp. and may > contain information which is privileged, confidential, and/or protected by > non-disclosure agreements. They are intended solely for the use of the > named addressee(s). . Any unauthorized use or disclosure may be > unlawful. If you are not a named addressee, you must not use, disclose, > retain or reproduce all or any part of the information contained in this > e-mail or any attachments If you have received this transmission in error, > please destroy it and notify us immediately by return e-mail or by calling > + 1 888 208 9005. >