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July 1998

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Sender:
TechNet <[log in to unmask]>
Date:
Tue, 14 Jul 1998 17:37:06 +0000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, MICHAEL DODSON <[log in to unmask]>
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Subject:
Flow patterns on multi-layer boards
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1.0
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From:
MICHAEL DODSON <[log in to unmask]>
Comments:
Authenticated sender is <MYKED@[192.9.200.50]> RFC822 error: <W> DATE field duplicated. Last occurrence was retained.
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text/plain (25 lines) 
To whom it may concern:

Seeking information on Flow Patterns for inner layers.
1.) What type of patterns are being used?. i.e.
cross hatch, diamond, dot pattern etc.
2.) Any special benefit for using a specific flow pattern?
3.) Any positive or negative issues to be aware of.

Please let me know if you need additional information to answer my
questions. Thank you.

Myke D.

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