TECHNET Archives

March 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
Subject:
soldermask cure
From:
Mike Johnson <[log in to unmask]>
Date:
Wed, 18 Mar 1998 17:49:03 -0600
Content-Type:
text/plain
MIME-Version:
1.0
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Mike Johnson <[log in to unmask]>
Parts/Attachments:
text/plain (21 lines) 
We have recently stopped using metheline chloride to test the cure of
our liquid imaginable soldermask and nomenclature for safety and
environmental issues. Is there another method that anyone knows of that
is safer for personnel and environment that is cost effective?  Please
help.
 Mike Johnson
Quality support services lead
PC boards Chanute, Kansas

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################

ATOM RSS1 RSS2