Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0w22YI-0007zWC; Tue, 4 Mar 97 16:19 CST |
Encoding: |
32 TEXT |
Old-Return-Path: |
|
Date: |
Tue, 04 Mar 97 16:27:00 CST |
Precedence: |
list |
Resent-From: |
|
Message-ID: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"El43.0.fBD.b_97p"@ipc> |
Subject: |
|
From: |
|
From [log in to unmask] Wed Mar 5 15: |
18:22 1997 |
X-Loop: |
|
X-Mailer: |
Microsoft Mail V3.0 |
Resent-Sender: |
|
Parts/Attachments: |
|
|
Try Repair Technology, I think they provide repair equipment for replating
Au surface for gold fingers.
----------
From: TechNet-request
To: TechnetPost
Subject: Gold/Tin - How to Remove Sn and Replate Au
Date: Tuesday, March 04, 1997 3:58PM
Subject: Gold/Tin
Darrell Daigle posted a request for info on the effect of solder on a
gold-plated finger that is to be inserted in a gold socket.
[Body deleted]
Where the operating environment can lead to corrosion for any of these
reasons, the corrective action is to remove the solder and replate the
gold.
----------
I did not know it was possible to remove solder and replate gold... There
has been a couple of emergency situations when we would have like to have
this capability, be it for PCB's or components, or other... Can someone
provide specifics?
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|