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Date: | Mon, 10 Apr 2000 16:24:11 -0700 |
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Thanks Werner, the modules we produce are through hole technology.
Soldering integrity of a connector has been the biggest concern. A
conversation with an AMP engineer has been most helpful. Well sort of!!!!
Thanks for your reply
Jason
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Thursday, April 06, 2000 7:03 AM
To: [log in to unmask]
Subject: Re: [TN] Reliability Engineering - Automotive
Hi Jason,
You should start with IPC-SM-785, Guidelines for Accelerated Reliability
Testing of Surface Mount Solder Attachments, and IPC-D-279, Design
Guidelines
for Reliable Surface Mount Technology Printed Board Assemblies, particularly
Appendices A & B. And then, Steve Gregory's advice is a pretty good one (if
I
say so myself, thanks Steve).
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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