Hi Technetters!

Does anyone know if there's an allowable percentage maximum of silica filler used in FR-4 PCB material?

"Fillers such as silica and aluminum hydroxide are added to the epoxy resin primarily to lower the coefficient of thermal expansion (CTE) of
the laminate while enhancing the flame retardant ability and reducing material cost."

From "Controlling Moisture in Printed Circuit Boards" published in the IPC Printed Circuit Expo, APEX & Designer Summit Proceedings

Thanks,

Ron



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