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April 2000

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TechNet <[log in to unmask]>
Subject:
Module failure
From:
"Jason Larson, CET" <[log in to unmask]>
Date:
Fri, 14 Apr 2000 09:44:28 -0700
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"TechNet E-Mail Forum." <[log in to unmask]>, "Jason Larson, CET" <[log in to unmask]>
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What type of testing would be appropriate for a module that was returned as
defective yet passed the production tester when it was received back to the
factory?

Would a stress test to failure be appropriate? Immediate dissection? Thermal
profile testing?

What data can be learned from the modules failure?


Thanks for the help
Jason

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