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November 2005

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Tue, 15 Nov 2005 17:05:47 EST
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
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Werner Engelmaier <[log in to unmask]>
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Hi Ofer,
Solder joint creep-fatigue is a wear-out damage mechanism and as such has not
a constant failure rate. thus, the concept of MTBF does not make sense for
solder joints, LF or not.



Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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