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| From [log in to unmask] Sat Apr 27 14: |
32:21 1996 |
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I am looking for off-the-shelf printed wiring boards and ball grid array
package samples (preferably ceramic) for the profiling of assembly process
parameters.
Also, are there any experienced assemblers willing to attach two 1mm pitch
ceramic BGA's on two assemblies.
Please contact:
Kevin Thorson
(612) 456-2639
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