I'm hoping to get an informal poll of fabricators and people who specify
bare board materials.

There's been a lot of literature and presentations lately that
recommend numbers for better material performance under the higher soldering
temperatures.

IPC-4101/126
Tg=170 or higher
Td=340 or higher
maximum expansion 3%
etc.

I'm not questioning the wisdom of the numbers, I'd just like to know whether
everyone (who is doing lead free soldering) is really USING these numbers?
Or this material? Is there no wiggle room anymore? (EVERY example I see now,
lists /126 material)

I've also been advised to use a thicker minimum hole wall thickness than
before. Is that common now? >1mil?

thanks,
Jack

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