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| From [log in to unmask] Tue Nov 19 09: |
21:16 1996 |
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id m0vPahz-0000RYC; Mon, 18 Nov 96 14:54 CST |
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I am working on the design of a PCB with rather large ceramic BGAs (47mm
sq., 1284 pins) and one of my main concerns is stress in the balls as a
result of the TCE mismatch between package and board. We plan on using
FR4 but would consider other materials if the improved reliability is
worth the cost. If anyone has experience with this and can give me any
advice, or at least recommend some literature, I would greatly appreciate
it. We have never done a design like this and are mostly worried about
reliability. Thanks,
Andy Buonviri ([log in to unmask])
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