TECHNET Archives

December 1997

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Date:
Wed, 3 Dec 1997 12:17:58 -0800
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"TechNet Mail Forum." <[log in to unmask]>, MARK SIMMONS <[log in to unmask]>
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V-SCORE CENTRAL
From:
MARK SIMMONS <[log in to unmask]>
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Dear H, pattern plating of outer layers can produce a big variation in
plating heighth (depending on circuit design and current density).
Panel plating produces a uniform surface which improves solder mask
applications.  High plating makes for some pretty skinny coverage at the
top of the trace, eh?   Hope this helps.

Mark Simmons, V-Score Central

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