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March 2003

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TechNet <[log in to unmask]>
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"TechNet E-Mail Forum." <[log in to unmask]>, Mike Wolf <[log in to unmask]>
Date:
Thu, 20 Mar 2003 16:31:27 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Quality <[log in to unmask]>
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Subject:
Re: Adhesion without oxide?
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Quality <[log in to unmask]>
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<[log in to unmask]>
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Mike,

If you try to bond without oxide (or oxide alternative) watch out for
the foil.  We don't run double treat so I can't comment but if you
use a reverse treat, (RTC, MLS, DST)  the copper treatment will
differ among foil suppliers and the laminators use multiple foil
suppliers.

pete


On 20 Mar 03, at 7:53, Mike Wolf wrote:

> Is it possible to get good adhesion on inner layers without an oxide treatment?
>
>
> Michael Wolf
> EH&S Manager
> EVI Technology LLC
> 7138 Columbia Gateway Drive
> Columbia MD 21046
> Phone # 443-542-0127
> Fax      # 410-290-1925
> [log in to unmask]
> www.evitechnology.com
>
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