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December 2005

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Tue, 13 Dec 2005 21:05:37 EST
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
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Werner Engelmaier <[log in to unmask]>
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Hi Charlie & All,
Perhaps, somebody already has developed a "Lamination Coupon." ANYBODY?
Also, in response to some questions, the 'Soldering Temperature Impact Index 
[STII]' is defined as follows

STII = {[Tg + Td]/2} - (% thermal expansion from 50 to 260°C)x10

I tried to weigh each of the parameters according to the way I perceive their 
impact; Tg gives to the transition to the rubbery state with its huge changes 
in properties; Td includes the temperature/time impact; and the thermal 
expansion the impact on the via loading.
An STII > 215 is a good number for LF-soldering.



Werner

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