TECHNET Archives

July 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show HTML Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Bryan Kerr <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 7 Jul 1999 21:39:56 +0100
Content-Type:
multipart/alternative
Parts/Attachments:
text/plain (268 bytes) , text/html (658 bytes)
Hi all,
Any experiences with Humiseal 1B73. I'm finding it tends to pull away easily from a solder resist surface, particularly on boards with heatsinks, along the edge of the heatsink profile. Thermal cycling makes it much worse. Any similar problems out there ?

Bryan


ATOM RSS1 RSS2