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| From [log in to unmask] Thu Apr 3 11: |
08:35 1997 |
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Thu, 3 Apr 1997 11:04:58 -0600 (CST) |
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IPC-SM-786A is the industry standard for storage of moisture-sensitive
surface mount devices. For sensitive parts, recommendations include
drypacking in moisture barrier bags (w/ dessicant) or storing in a
nitrogen cabinet.
IPC-SM-786A is available from IPC's order department, ext. 348, or email
[log in to unmask] Cost is $20 for IPC members; $40 for nonmembers.
The task group that wrote the standard is now trying to work with Jedec
(which represents many component suppliers) to develop a joint
standard for handling. IPC and Jedec published a joint standard on
classification--J-STD-020--last October.
Mike Buetow
IPC Staff
2215 Sanders Road
Northbrook, IL 60062
P: 847-509-9700, ext. 335
F: 847-509-9798
[log in to unmask]
On Thu, 3 Apr 1997 [log in to unmask] wrote:
> To All:
>
> This week someone asked about bottom side components and
> thru the wave soldering-Is it ok? Well I have an opinion and some
> experience with "pop corning" of components. Essentially not
> many component manufacturers will recommend an IC "thru" the
> wave. Mfgr's will ask questions like what are the temps and dwell
> times and cool down period prior to aqueous cleaning. Components
> can be very vulnerable when they are put "thru" the wave. Especially,
> if they are saturated with moisture.
>
> However, I have a related question which has to do with component
> -semiconductor-storage. Every manufacturer recommends storage
> specs. And, one only needs to view the spec to find that out. My
> question is this: Is there an industry standard which governs the
> storage of components?
>
> My company is presently looking into techniques which will safegard
> componets from moisture entrappment. This information would be
> helpful in establishing a footprint.
>
> Thankyou
>
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