TECHNET Archives

August 1997

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TechNet Mail Forum<[log in to unmask]>
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Thu, 14 Aug 1997 16:09:35 -0600
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"TechNet Mail Forum." <[log in to unmask]>, Paul Stolar <[log in to unmask]>
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Paul Stolar <[log in to unmask]>
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     One more problem is the quality of the gold. I had more problems with
     'shiny' gold. It is shiny because they add Hg to it. This plays havoc
     with wire bonding.

     I generally did not have problems bonding to smooth surfaces, assuming
     the gold was bonded to the nickel. That brings up another point,
     sometimes we saw contamination at the Ni-Au interface.


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Subject: Re: [TECHNET] Finish for wirebond
Author:  <[log in to unmask]> at internet


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