> He was the best manager I ever had. His mind was, as you described, like
> a razor. He could cut through the crap and get to the root cause(s) of a
> problem better than anyone I have ever met.
Couldn't agree with you more ;-)
Ken
Sent from my old and busted desktop
On Sat, Sep 26, 2015, at 07:38 AM, Stadem, Richard D. wrote:
> The first day I met Werner was when my manager at Honeywell introduced
> him to me and told me he would be my manager temporarily while we were
> working through some issues on the A-12 stealth program. Werner said we
> should sit down and go through some of the problems that were being seen
> and my manager agreed.
> So we went golfing! We had to have a cart because, as Werner said, we
> were to sit down and discuss these things.
> He was the best manager I ever had. His mind was, as you described, like
> a razor. He could cut through the crap and get to the root cause(s) of a
> problem better than anyone I have ever met.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Harp
> Sent: Thursday, September 24, 2015 7:56 PM
> To: [log in to unmask]
> Subject: Re: [TN] Component solder reliability
>
> I was so bummed out when Werner passed. Worked with him for a few months
> about a year before (hired him as a consultant at the firm I was working
> at at the time) for a BGA application. Talk about brilliant, he had a
> mind like a knife.
>
> Ken
> Sent from my old and busted desktop
>
> On Thu, Sep 24, 2015, at 05:49 PM, Bev Christian wrote:
> > Rongjun,
> > If Werner Engelmaier were still alive he would shake his finger at you!
> > :)
> >
> > Solder joint strength is not necessarily a sign of a reliable joint.
> > It might or might not mean that a joint is well made but not say much
> > about reliability. For instance Ericsson (I believe) found that small
> > (lower shear strength) solder joints for chip components were actually
> > better because they were more ductile.
> >
> > That is why you will never find an official published list of
> > pass/fail solder joint strengths.
> >
> > Bev
> > Blackberry
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Deng RongJun
> > Sent: September 24, 2015 3:31 AM
> > To: [log in to unmask]
> > Subject: [TN] Component solder reliability
> >
> > Hi Experts:
> >
> >
> >
> > Is there have an industry standard for component pull/push test? What
> > is standard value for each component?
> >
> >
> >
> >
> >
> > RongJun Deng
> >
> > Electronics Engineer
> >
> > Design Link
> >
> > BB Electronics (Suzhou) Co., Ltd., EMS - from idea to solution
> >
> >
> >
> > Block E, No.58 Yangdong Road, Loufeng, Suzhou Industrial Park- 215122
> > Suzhou - P.R.China
> >
> > Office: +86 512 6956 2880 - Direct: +86 512 6956 0125 - Fax: +86
> > 512 6715 7266
> >
> >
> >
> > ______________________________________________________________________
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