> He was the best manager I ever had. His mind was, as you described, like > a razor. He could cut through the crap and get to the root cause(s) of a > problem better than anyone I have ever met. Couldn't agree with you more ;-) Ken Sent from my old and busted desktop On Sat, Sep 26, 2015, at 07:38 AM, Stadem, Richard D. wrote: > The first day I met Werner was when my manager at Honeywell introduced > him to me and told me he would be my manager temporarily while we were > working through some issues on the A-12 stealth program. Werner said we > should sit down and go through some of the problems that were being seen > and my manager agreed. > So we went golfing! We had to have a cart because, as Werner said, we > were to sit down and discuss these things. > He was the best manager I ever had. His mind was, as you described, like > a razor. He could cut through the crap and get to the root cause(s) of a > problem better than anyone I have ever met. > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Harp > Sent: Thursday, September 24, 2015 7:56 PM > To: [log in to unmask] > Subject: Re: [TN] Component solder reliability > > I was so bummed out when Werner passed. Worked with him for a few months > about a year before (hired him as a consultant at the firm I was working > at at the time) for a BGA application. Talk about brilliant, he had a > mind like a knife. > > Ken > Sent from my old and busted desktop > > On Thu, Sep 24, 2015, at 05:49 PM, Bev Christian wrote: > > Rongjun, > > If Werner Engelmaier were still alive he would shake his finger at you! > > :) > > > > Solder joint strength is not necessarily a sign of a reliable joint. > > It might or might not mean that a joint is well made but not say much > > about reliability. For instance Ericsson (I believe) found that small > > (lower shear strength) solder joints for chip components were actually > > better because they were more ductile. > > > > That is why you will never find an official published list of > > pass/fail solder joint strengths. > > > > Bev > > Blackberry > > > > -----Original Message----- > > From: TechNet [mailto:[log in to unmask]] On Behalf Of Deng RongJun > > Sent: September 24, 2015 3:31 AM > > To: [log in to unmask] > > Subject: [TN] Component solder reliability > > > > Hi Experts: > > > > > > > > Is there have an industry standard for component pull/push test? What > > is standard value for each component? > > > > > > > > > > > > RongJun Deng > > > > Electronics Engineer > > > > Design Link > > > > BB Electronics (Suzhou) Co., Ltd., EMS - from idea to solution > > > > > > > > Block E, No.58 Yangdong Road, Loufeng, Suzhou Industrial Park- 215122 > > Suzhou - P.R.China > > > > Office: +86 512 6956 2880 - Direct: +86 512 6956 0125 - Fax: +86 > > 512 6715 7266 > > > > > > > > ______________________________________________________________________ > > This email has been scanned by the Symantec Email Security.cloud service. > > For more information please contact helpdesk at x2960 or > > [log in to unmask] > > ______________________________________________________________________ > > > > ______________________________________________________________________ > > This email has been scanned by the Symantec Email Security.cloud service. > > For more information please contact helpdesk at x2960 or > > [log in to unmask] > > ______________________________________________________________________ > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________