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Date: | Mon, 20 Dec 2004 10:53:21 -0500 |
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Hi fellow Techneters,
I have many questions on the "paste in hole" or "pin in paste" process. For
a bit a equipment background, we have batch style equipment (screen printer,
placement machine and 5 zone reflow oven) I want to be able to solder THT
connectors in the SMT process and expect the connectors to be placed by
hand.
How do I design the stencil for the THT connectors? Someone said to put four
small squares of paste around each hole of the connector......
Do my reflow temps change a great deal? Is there anything else I need to
consider? Is the reliability of this process proven???.... and we don't have
to expect any great field issues as long as we stick to IPC-A-610?
Many questions for a Monday.....
Thanks in advance for your feedback and help
Peter Crain
Manufacturing Engineering
> Network Reliability Services
> General Electric Canada Inc.
> 2728 Hopewell Place N.E., Calgary, Alberta T1Y 7J7 CANADA
> Tel: 403.214.4560, Dialcomm: 8.498.4560 Fax: 403.214.4776
> Email: [log in to unmask]
> Website: www.gepower.com/substationautomation
>
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