revenons a nos moutons

Brian,
We have been running 10 cells for about 2&1/2 years now.  Biggest motivation
for switching was throughput and surface distribution particularly on
smaller surface  features. Our target is 1.3 mils in the hole & 1.2 on the
surface in 70 mins.. We do this on .093" bds wt .010" holes in a 20 year old
bare bones no options automatic.  Haven't really had the time nor need to
test much higher than that.

However, there are definite limits to what it can overcome for any
particular cell setup, Ground Planes, isolated traces, high aspect ratios,
etc. Since many of these things can not be adjusted, you have to experiment
to find a happy median for most things and what the real limits are for the
rest. Hope this answers your original question.

1.      Benefits
        a. shorter cycle times on difficult jobs
        b. less surface copper on isolated features = less copper and LPI usage
        c. ability to run finer spaces without resist lock-in
        d. for myself the most important; more copper in the holes = more robust
vias
2.      Disadvantages?
        a. higher additive cost, minor + should continue to come down?
        b. capital -  9-12 month ROI just in material savings?
        c. can't have any marginal connections/bussing, only good or bad boards?

Lurking in the background Welch
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of brian carlson
Sent: Wednesday, November 24, 1999 11:19 AM
To: [log in to unmask]
Subject: [TN] Pulse plating


Technet,

   Can someone give me an insight on benefits or possible disadvantages to
pulse plating. I am interested to hear some stories of what happens to the
Cu thickness in the hole wall when aspects ratios increase to 15:1. Any
feedback is welcome.

Rgds,
Brian



Brian Carlson
Technical Support Engineer
Yamamoto Mfg. (USA), Inc.

(408)944-8368 (Office)
(800)514-6246 (Pager)
(408)944-1361 (Fax)

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