Hi Dale,

Was this deflection seen during the print process?  Many times the
printer has better support than the placement equipment does (but not
necessarily).  The placement equipment should be putting down the
components into the paste.

If indeed the process was out of control and the paste thicknesses
varied to the extreme, then yes there is more solder possible.
Typically I have seen sag in larger panels due to weak routing but as
long as the paste deposition was well controlled, we did not see issues
after reflow.

Phil

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hart, Dale L CTR
USAF AFMC AFRL/RXSA
Sent: Monday, October 04, 2010 11:26 AM
To: [log in to unmask]
Subject: [TN] pick and place /board deflection

 

I was on the shop floor and noticed deflection in the 8x8 inch panel
that
was being populated.  Would the deflection in the middle of the panel
cause
components to sit higher on the paste and thus have a slightly higher
solder
joint height than components on boards along the rails?       Thanks in
advance

 

Dale L. Hart

Universal Technology Corporation (UTC)

Failure Analysis

1270 North Fairfield Road

Dayton, Ohio  45432-2600

(937) 656-9165

Fax (937) 656-4600

Email:  <mailto:[log in to unmask]> [log in to unmask]

 


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