Hi Dale, Was this deflection seen during the print process? Many times the printer has better support than the placement equipment does (but not necessarily). The placement equipment should be putting down the components into the paste. If indeed the process was out of control and the paste thicknesses varied to the extreme, then yes there is more solder possible. Typically I have seen sag in larger panels due to weak routing but as long as the paste deposition was well controlled, we did not see issues after reflow. Phil -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Hart, Dale L CTR USAF AFMC AFRL/RXSA Sent: Monday, October 04, 2010 11:26 AM To: [log in to unmask] Subject: [TN] pick and place /board deflection I was on the shop floor and noticed deflection in the 8x8 inch panel that was being populated. Would the deflection in the middle of the panel cause components to sit higher on the paste and thus have a slightly higher solder joint height than components on boards along the rails? Thanks in advance Dale L. Hart Universal Technology Corporation (UTC) Failure Analysis 1270 North Fairfield Road Dayton, Ohio 45432-2600 (937) 656-9165 Fax (937) 656-4600 Email: <mailto:[log in to unmask]> [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- ------------------------------------------------------------------------------ This message and any attachments are solely for the use of the addressee and may contain L-3 proprietary information that may also be defined as USG export controlled technical data. If you are not the intended recipient, any disclosure, use or distribution of its content is prohibited. Please notify the sender by reply e-mail and immediately delete this message and any attachments. ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------