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November 2001

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From:
"Marsico, James" <[log in to unmask]>
Date:
Fri, 2 Nov 2001 13:50:34 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>
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Hi Werner, try
http://www.matweb.com <http://www.matweb.com>

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879



        -----Original Message-----
        From:   Werner Engelmaier [SMTP:[log in to unmask]]
        Sent:   Thursday, November 01, 2001 11:20 AM
        To:     [log in to unmask]
        Subject:        [TN] Thermal Capacity

        Hi,
        I would appreciate any info I could get on the Specific Heat/Thermal
Capacity
        [J/g.C]/Thermal Mass [J/mm3.C] of the following materials:
        FR-4 (glass-epoxy); Polyimide (glass-epoxy); Polyimide (resin only);
Mold
        Compound; Ceramic; Silicone; Alloy 42; Solder; Copper.
        Thanks,

        Werner Engelmaier


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