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July 1998

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Sender:
TechNet <[log in to unmask]>
Date:
Wed, 29 Jul 1998 10:38:09 -0400
Reply-To:
[log in to unmask]
Subject:
Solid Solder Deposits
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1.0
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Organization:
Phoenix Engineering Design, Inc.
From:
Ryan Jennens <[log in to unmask]>
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text/plain (22 lines) 
Howdy all-

    Does anybody have any experience with solid solder deposits as an
alternative to paste deposits?  I have heard many good things, but do
board fabricators have the technology to do this?  Where can I get more
information on how to try this technology out?

Ryan Jennens
Phoenix Engineering

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