Good afternoon everyone....

We have been experiencing small solder balls after our wave soldering
process on assemblies with bottom side SMT components.  The solder balls
typically accumulate between the lead of the surface mount IC's (glued SMT
components and then wave soldered). The flux coverage and top side board
temperature of these assemblies are within the recommend manufacturer's
range.

Any other parameters that would be causing solder balls on bottom side SMT
assemblies?  Could the pcb material finish be causing a problem?

Please advise.

Rich

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