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June 1999

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TechNet <[log in to unmask]>
Subject:
Solderpaste height
From:
CharlesC <[log in to unmask]>
Date:
Thu, 24 Jun 1999 08:57:06 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, CharlesC <[log in to unmask]>
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First, thanks for the informatioin on silver immersion. My next question will
probably be of interest to a larger audience. We are starting to implement SPC
on our SMT process.

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