Subject: | |
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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 17 Dec 2003 06:33:10 -0600 |
Content-Type: | text/plain |
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Gunter,
I do not recall this publication. Can you share a URL address for
viewing.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guenter Grossmann
Sent: Wednesday, December 17, 2003 2:51 AM
To: [log in to unmask]
Subject: [TN] Antw: Re: [TN] solder structure
Susan, Victor
We have pictures of
- SnAg3.8Cu0.7
- SnAg3.5
- SnZn9
- SnBi57
Some of them are published in:
- No fear of Lead Free Solder, 21. ICEC 2002, Zurich. ISBN 3-9522504-0-6
- Results of Comparative Reliability Tests on Lead Free Solder, 52 ICTC San
Diego 2002, ISSN 0569- 5503
More publications are in preparation.
Best regards
Günter
EMPA
Swiss Federal Laboratories for Materials Testing and Research Centre for
Reliability Guenter Grossmann, Senior Engineer
8600 Duebendorf
Switzerland
Phone: xx41 1 823 4279
Fax : xx41 1 823 4054
mail: [log in to unmask]
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