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October 1999

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TechNet <[log in to unmask]>
Subject:
Re: COB,FP,TAB/Wire bond/plasma clean
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Date:
Mon, 11 Oct 1999 17:32:36 +0200
MIME-Version:
1.0
X-To:
Carey Pico <[log in to unmask]>, Nicholas LAI <[log in to unmask]>, "Christian Skeppstedt (EMW)" <[log in to unmask]>
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, "Ingemar Hernefjord (EMW)" <[log in to unmask]>
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Carey, me again.

a) What kind of films then? Can you tell more? Have you any report? You said A, now say B.
b) You mean that microwelds can not be created?

/Ingemar


  Thin films
and interfaces can be extremely strong.  The strength of thin films can be
1000X higher than bulk equivalents and their other properties (e.g.,
electrical) vary as well with thickness.
Carey

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