 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vXXLf-0000b0C; Tue, 10 Dec 96 12:56 CST |
| Old-Return-Path: |
|
| Date: |
Tue, 10 Dec 1996 13:10:54 -0500 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| From [log in to unmask] Tue Dec 10 17: |
03:21 1996 |
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"YvhGd2.0.oLO.79Rho"@ipc> |
| Subject: |
|
| From: |
|
| X-Status: |
|
| X-Loop: |
|
| X-Mailer: |
Novell GroupWise 4.1 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
We are contract manufacturers and currently have a customer that
requires us to use Wakefield 120 heatsink compound.
We would like to be able to apply it to the device and the heatsink prior to
Wave Solder and Aqueous cleaning, but the Wakefield compound doesn't
cure and runs when put thru the Aqueous.
Does anyone have a suggestion for a different one-part compound that
would hold up to the Aqueous process ( just hot water 180 degrees F)
[log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|
