Victor/Bev,
I was able to get decent images from my Sonix acoustic microscrope, but as Bev said, it is not super-sharp and crisp, as the weave does alter the velocity of the signal quite a bit (and scramble it somewhat). But this also makes for an interesting signal sometimes.
In a low frequency thru-transmission mode, with an obvious delamination (read as definite air gap), the signal is totally attenuated and therefore shows up well (but if there are components in the way - on either side - all is lost). Was not successful in a reflected mode of operation.
Not sure if Sonoscan equipment could do as well. Maybe someone with that flavor of equipment could enlighten us all.
Ditto the cross-section comment
Wish I still had my acoustic scope here.
Steven Creswick - Gentex Corporation
-----Original Message-----
From: Bev Christian [mailto:[log in to unmask]]
Sent: Wednesday, September 03, 2003 1:13 PM
To: [log in to unmask]
Subject: Re: [TN] PCB delamination Evaluation
Victor,
I stand to be corrected, but to my understanding you cannot use CSAM for PCBs because the glass fibers disperse the signal and no useful information can be collected. X-ray would be tough. Unless you can correlate distance between internal traces examined at an oblique angle, I can't see how you could use x-rays for this problem. Sometimes nothing replaces cross-sectioning.
regards,
Bev Christian
Research in Motion
-----Original Message-----
From: Victor Hernandez [mailto:[log in to unmask]]
Sent: September 3, 2003 12:12 PM
To: [log in to unmask]
Subject: [TN] PCB delamination Evaluation
Fellow TechNetters,
Are there any case studies out there that may apply to the following request.
Can varying degrees of delamination be identified with CSAM and correlated with x-ray imaging and followed up with
destructive cross section analysis. Is it possible to see the above stated artifact on a PCBA with PBGA package.
Given: The suspected delamination induced by excessive rework, Thermal Excursion and/or too high Assembly Process Profile.
Victor,
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